Model Number: DS-800A BGA rework station
Brand Name: DS-800A BGA rework station
Key Specifications/Special Features:
Auto profile CCD camera equipped DS-800A BGA rework station with HDMI image systemFeature of DS-800A BGA rework station:1. Hot air head and mounting head integration design, with auto soldering and disordering functions2. Upper heaters adopt hot air system, heating faster, temperature evenness, cooling faster (temperature can be up to 50 to 80 centigrade) can better meet technological requirements about lead-free solderingLower heaters adopt Hot air & IR mix heating, IR acts on the heating area directly, in the meanwhile, hot air worksThey interact to heat quickly, and keep temperature even heating-up speed is up to 10 centigrade per minute3. Independent 3 heaters, upper and lower heaters can realize move synchronously and automatically, can reach IR every positionLower heater zone can remove up and down, supports PCB boardBottom pre-heating area along X/Y axis
Lower heater can move up/down and support PCB, auto-controlled by motors can realize the upper and lower heater able to move towards target BGA, without moving PCB
4. PCB board adopts high accuracy slider to make sure the mount precision of BGA and PCB
5. Unique bottom preheating table made of Germany-imported good quality heating materials plated IR tube and constant temperature glass anti-dazzle (heat-resist up to 1800 C), pre-heating area up to 500*420mm
6. Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating and disordering safer and conveniently
7. X and Y axis adopt motor automatic control moving way to make the alignment faster and more convenient, make the most use of the equipment space, realization of repairing large area PCB with a smaller volume of equipment
Max plate size can reach 650*610mm, no repair dead corner
8. Double rocker control camera and upper and lower heating platform to make sure the alignment precision accuracy
9. Inbuilt vacuum pump, rotate 360 in angel, fine-adjusting mounting suction nozzle
10. Suction nozzle can detect BGA pick up and mounting height automatically with pressure controllable within 10 grams, zero pressure available to smaller BGA pickup and mounting
11. Color high-resolution optical vision system, movable by hand in X/Y axis, with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom, rework able max
BGA size 80*80mm
12. 10 segments of temperature up (down) and 10 segments of constant temperature control, can save many segments of temperature
Analyze temperature parameter curves on the touchscreen
13. Many sizes of alloy nozzle, easy for replacement, can locate at all angle
Max PCB size |
(W) 650 * (D) 610mm |
PCB thickness |
0.5-8mm |
BGA size |
1*1-80*80mm |
Min ball pitch |
0.15mm |
Max weight of BGA |
1000g |
Placement precision |
±0.01mm |
PCB locating way |
outer or location hole |
Temperature control |
K-type thermocouple, close loop control |
Total power |
7400w |
Power supply |
(double phase) 220V, 50/60Hz |